TI DLP® technology enables next-generation augmented reality head-up displays
New automotive-qualified DLP3030-Q1 chipset and EVMs allow automakers and Tier-1 suppliers to create HUD systems with crisp, high-quality imagery (PRNewsfoto/Texas Instruments Incorporated)
Texas Instruments (TI) (NASDAQ: TXN) today unveiled the next evolution of DLP® technology for in-vehicle head-up display (HUD) systems. The new DLP3030-Q1 chipset, along with supporting evaluation modules (EVMs), gives automakers and Tier-1 suppliers the ability to bring bright, dynamic augmented reality (AR) displays to windshields and place critical information within the driver's line of sight.
The combination of increased VIDs and ability to showcase imagery across a wide field of view (FOV) gives designers the flexibility to create AR HUD systems with enhanced picture depth for an interactive, not distractive infotainment and cluster system.
- Designed and optimized for AR: Easily manages the solar load resulting from longer VIDs (Virtual Image Distance) greater than 7.5 meters, while supporting large displays up to 12 by 5 degrees FOV.
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