Intel’s ‘3D’ Lakefield chips arrive for foldables and ultrathin laptops
Intel's mobile client platform, code-named “Lakefield,” introduces the industry’s first product with 3D stacking and hybrid computing architecture. Leveraging Intel’s latest 10nm process and Foveros advanced packaging technology, Lakefield offers OEMs more flexibility for thin-and-light form factor PCs. (Credit: Intel Corporation)
Intel is able to combine multiple chip architectures and onboard memory onto a single processor thanks to its Foveros 3D packaging technology. That allows the company to stack multiple logic and memory dies on top of each other, instead of spreading them out on a flat 2D plane like traditional processors. The basic takeaway is that Lakefield chips also won't need to take up much physical space, making them ideal for very thin devices.
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