MIT has devised a way of creating complex, self-assembling 3D nanostructures of wires and junctions. While self-assembling structures have been made from polymers before, this is the first time that multi-layer, configurable layouts have been created, opening up the path to self-assembled computer chips.
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MIT has devised a way of creating complex, self-assembling 3D nanostructures of wires and junctions. While self-assembling structures have been made from polymers before, this is the first time that multi-layer, configurable layouts have been created, opening up the path to self-assembled computer chips.